With the continuous development of society, today’s era is an era of information technology. Semiconductors and integrated circuits have become the theme of the current era. What directly affects the mechanical properties of semiconductors and integrated circuits is the process of chip packaging. Chip packaging has always been an industry A big problem in production, then how did the automatic dispenser overcome this problem, and how did it apply in the chip packaging industry? Below, please see the analysis of the technical staff of Shenzhen Dispensing Machine Manufacturer Shichun Intelligent!
How is the automatic dispenser used in the chip packaging industry?
First, the chip bonding aspect
PCB is prone to displacement during the bonding process. In order to prevent electronic components from falling off or shifting from the PCB surface, we can use automatic dispenser equipment to dispense on the PCB surface, and then put it in an oven for heating and curing. The electronic components can be firmly pasted on the PCB.
Second, the filling of the primer
I believe that many technicians have encountered such a problem. In the chip flip process, because the fixed area is smaller than the chip area, it is difficult to bond. If the chip is impacted or expanded by heat, it is easy to cause the bumps to break , The chip will lose its due performance. In order to solve this problem, we can inject organic glue into the gap between the chip and the substrate through an automatic dispensing machine, and then solidify it, which effectively increases the connection between the chip and the substrate. The area further improves their bonding strength and has a good protective effect on the bumps.
Third, surface coating
After the chip is soldered, we can apply a layer of epoxy resin with low viscosity and good fluidity between the chip and the solder joints through an automatic dispenser and cure it, so that the chip is not only improved in appearance, but also Prevent the erosion and stimulation of foreign objects, can play a very good protective effect on the chip, and extend the service life of the chip!
In summary, the above is the application of automatic dispensers in the chip packaging industry for chip bonding, primer filling, surface coating, etc. We can apply this method to our daily work, which will greatly improve Our work efficiency, with this method, there is no need to worry about chip packaging problems!
6.35MM Power+ Signal Power Connector
power connector is used in power module system. It can select the matching power + signal connector according to the need. The feature is that the number of power and signal contacts and the matching sequence can be selected arbitrarily while keeping the connector size and contact core number unchanged.
Plug (male) / socket (female) can be installed at 90 or 180 degrees. It supports mixed or independent combination of signal and power. The quantity range of power and signal is (2-16) pin and (12-128) pin respectively
Product features
High temperature resistant, glass fiber reinforced and flame retardant polyester is used as insulation material
Copper gold composite conductor with high conductivity is used, and the contact area of the conductor is plated with gold
It adopts shrapnel contact, which has the characteristics of integration, small volume, large current carrying capacity, soft plug-in, blind plug-in, self guidance and high dynamic contact reliability. This series of products can be interchanged with FCI's powerblade series and Tyco's multi-beam series
There are three sizes of center distance of power contact: 5.08mm, 6.35mm and 7.62mm
The length of power hole / signal pin can be selected in two sizes. The power rated current is 45A and the signal rated current is 2.5A
6.35MM Power+ Signal Power Connector
ShenZhen Antenk Electronics Co,Ltd , https://www.antenkelec.com