As one of Intel's main technologies, the 32-nanometer process is the highest level in the current processor manufacturing process. Higher process means better performance, lower power consumption and lower cost, and the Core I3 530 is The current 32-nanometer processor in the low-end market, the main force, I learned in the store today the price of this processor fell below 700 yuan, reaching a new low of 690 yuan, the boxed price has dropped to a new low of 740 yuan .
Core I3 530 processor is the low-end model of Core I3 series, dual-core design, clocked at 2.93GHz, FSB 133MHz, multiplier 22X, sharing the use of 4MB L3 cache, with Hyper-Threading, but remove the Turbo Boost Features. IGP part is a 45nm process DX10 specification display chip, frequency 733MHz. The processor uses the LGA1156 interface design, compatible with the P55 motherboard when not using the integrated graphics. The processor TDP is 73W.
Applicable type desktop CPU
CPU Series Core I3
Manufacturer Intel Core Type Clarkdale
CPU Architecture Nehelem
Core Number Dual Core Thermal Design Power (TDP) 73W
Core voltage 1.2VV
Production process 32nm frequency 2930MHz
FSB 133MHz
Multiplier 22x Slot Type LGA 1156
Number of pins 1156pin
Level 1 cache 2×64K
Level 2 cache 2×256K
Level 3 cache 4MB
Hyper-Threading Technology Supports 64-bit Processor is Memory Controller DDR3-1333
GPU frequency 733MHz
Other features have a certain 3D performance support DX10 effects other features Thread: 4
Does not support Turbo Boost technology
Core I3 530 processor is the low-end model of Core I3 series, dual-core design, clocked at 2.93GHz, FSB 133MHz, multiplier 22X, sharing the use of 4MB L3 cache, with Hyper-Threading, but remove the Turbo Boost Features. IGP part is a 45nm process DX10 specification display chip, frequency 733MHz. The processor uses the LGA1156 interface design, compatible with the P55 motherboard when not using the integrated graphics. The processor TDP is 73W.
Applicable type desktop CPU
CPU Series Core I3
Manufacturer Intel Core Type Clarkdale
CPU Architecture Nehelem
Core Number Dual Core Thermal Design Power (TDP) 73W
Core voltage 1.2VV
Production process 32nm frequency 2930MHz
FSB 133MHz
Multiplier 22x Slot Type LGA 1156
Number of pins 1156pin
Level 1 cache 2×64K
Level 2 cache 2×256K
Level 3 cache 4MB
Hyper-Threading Technology Supports 64-bit Processor is Memory Controller DDR3-1333
GPU frequency 733MHz
Other features have a certain 3D performance support DX10 effects other features Thread: 4
Does not support Turbo Boost technology
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