[Source: LED Engineering's "good LED products," September issue of the magazine reporter / gold] week "to die bonding paste based on market gradually cover package glues, integrated solutions to build the future of high-quality COB packaging materials suppliers." In an interview with the reporter of the high-tech "LED Good Products" magazine, Qian Xuexing, general manager of Shenzhen Chenri Technology Co., Ltd. (hereinafter referred to as "Crystal Technology"), told reporters about the future development of the company.
LED packaging process has been followed by a process of continuous innovation with the change of chip structure, especially the emergence of flip-chip LED chip technology, which brings the greatest process simplification to LED packaging and assembly, which greatly helps Packaging companies have reduced their investment in equipment and manpower.
However, for the packaging material manufacturers at the front end, the change in material requirements brought about by the new process has prompted the new packaging materials to become the key to the material manufacturers in the next stage.
“We have a group of Ph.D. and master's research and development teams with many years of R&D experience.†In order to meet the market demand, LED technology began to explore new materials and develop LED package assembly. Integrated material business development.
Integrated solution strategy
The company has been focusing on electronic soldering materials and LED packaging materials. After the emergence of new packaging trends, the company began to develop LED integrated manufacturing processes based on flip chip.
Qian Xuexing said that the focus will be on the mainstream COB packaging process and the future flip chip packaging process as the entry point, through three core materials (solid crystal solder paste, dam glue, jelly glue - one-component silica gel and fluorescent Powder mixing) to build the most simplified LED luminaire manufacturing solution.
In the morning of the LED packaging materials business, the silicone field is inevitably part of the company's overall strategy, but the silicone industry has a long history, especially in 2010, 2011, with integrated high-power packaging, COB high power The new packaging process represented by the packaging is gradually recognized by the market, and the market demand for products is growing rapidly.
>>>Unfinished , please refer to the September issue of Gaogong LED 's " LED Good Products" magazine.
LED packaging process has been followed by a process of continuous innovation with the change of chip structure, especially the emergence of flip-chip LED chip technology, which brings the greatest process simplification to LED packaging and assembly, which greatly helps Packaging companies have reduced their investment in equipment and manpower.
However, for the packaging material manufacturers at the front end, the change in material requirements brought about by the new process has prompted the new packaging materials to become the key to the material manufacturers in the next stage.
“We have a group of Ph.D. and master's research and development teams with many years of R&D experience.†In order to meet the market demand, LED technology began to explore new materials and develop LED package assembly. Integrated material business development.
Integrated solution strategy
The company has been focusing on electronic soldering materials and LED packaging materials. After the emergence of new packaging trends, the company began to develop LED integrated manufacturing processes based on flip chip.
Qian Xuexing said that the focus will be on the mainstream COB packaging process and the future flip chip packaging process as the entry point, through three core materials (solid crystal solder paste, dam glue, jelly glue - one-component silica gel and fluorescent Powder mixing) to build the most simplified LED luminaire manufacturing solution.
In the morning of the LED packaging materials business, the silicone field is inevitably part of the company's overall strategy, but the silicone industry has a long history, especially in 2010, 2011, with integrated high-power packaging, COB high power The new packaging process represented by the packaging is gradually recognized by the market, and the market demand for products is growing rapidly.
>>>Unfinished , please refer to the September issue of Gaogong LED 's " LED Good Products" magazine.
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