[High-tech LED reporter Zhu Chunwei] On November 26th, in the third session of the CTO conference held in conjunction with the 2013 Gaogong LED Lighting Exhibition, the title of the photovoltaics was held: the packaged devices, equipment and materials II were held in Hall 5, Guangzhou Poly World Trade Center. The meeting was hosted by Dr. Jin Peng, a professor at Peking University Shenzhen Graduate School.
In recent years, domestic packaging manufacturers are making full use of their localization and price advantages, and gradually gaining market quality by gradually introducing the lighting enterprise supply chain to gradually seize the market share of imported devices.
Zhang Lei, director of strategic research and development at Jingtai Optoelectronics, introduced the nine trends of LED future packaging and the latest COB packaging technology, development prospects and advantages of COB light sources.
In the field of lighting, from the comprehensive cost analysis, the cost of LED packaging accounts for about 40%-60%. The high price of LED products is the main obstacle to the popularization of application fields. It is able to improve product reliability and reduce product cost. Whether it is accepted by the public to replace the key elements and important trends of traditional lamps. As a new product, COB takes into account the advantages of these two aspects, and LED products will eventually become more and more integrated into evolution.
In the field of packaging, COB packaging is being favored by more and more enterprises due to its unique cost and technical advantages. Compared with the traditional package form, the COB package has the characteristics of small thermal resistance, high luminous flux density, small glare and uniform illumination.
At the beginning of 2012, Jingtai Optoelectronics took the lead in the industry to propose the MLCOB concept and successfully developed a variety of light engines based on MLCOB technology. “The efficiency of this product has reached 160lm/W, which is the highest light-efficiency product in the COB package.†Gong Wen told reporters that the COB package has good performance in horizontal heat dissipation and vertical heat dissipation under a limited volume. Achieving greater power in a small area will be an important trend in the future development of the LED packaging industry.
In recent years, domestic packaging manufacturers are making full use of their localization and price advantages, and gradually gaining market quality by gradually introducing the lighting enterprise supply chain to gradually seize the market share of imported devices.
Zhang Lei, director of strategic research and development at Jingtai Optoelectronics, introduced the nine trends of LED future packaging and the latest COB packaging technology, development prospects and advantages of COB light sources.
Zhang Lei, Director of Strategic Development, Jingtai Optoelectronics
In the field of lighting, from the comprehensive cost analysis, the cost of LED packaging accounts for about 40%-60%. The high price of LED products is the main obstacle to the popularization of application fields. It is able to improve product reliability and reduce product cost. Whether it is accepted by the public to replace the key elements and important trends of traditional lamps. As a new product, COB takes into account the advantages of these two aspects, and LED products will eventually become more and more integrated into evolution.
In the field of packaging, COB packaging is being favored by more and more enterprises due to its unique cost and technical advantages. Compared with the traditional package form, the COB package has the characteristics of small thermal resistance, high luminous flux density, small glare and uniform illumination.
At the beginning of 2012, Jingtai Optoelectronics took the lead in the industry to propose the MLCOB concept and successfully developed a variety of light engines based on MLCOB technology. “The efficiency of this product has reached 160lm/W, which is the highest light-efficiency product in the COB package.†Gong Wen told reporters that the COB package has good performance in horizontal heat dissipation and vertical heat dissipation under a limited volume. Achieving greater power in a small area will be an important trend in the future development of the LED packaging industry.
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