Better performance with carbon nanotubes instead of copper TSV chips

Researchers from Chalmers University of Technology in Gothenburg, Sweden, found that filling 3D chip stacks with TSVs with carbon nanotubes would be more effective than copper. .

Instead of arranging them in parallel on a circuit board, TSV uses a 3D stack to form a system, which increases the speed of communication between chips; unfortunately, the copper used to fill holes in silicon crystals will lead to The problem of thermal expansion, because copper heats up more than the surrounding silicon material.

"Many properties of carbon nanotubes are superior to copper, including coefficient of thermal expansion and electron conductivity;" Kjell Jeppsson, a member of the research team at Chalmers University of Technology, said: "The thermal expansion coefficient of carbon nanotubes is similar to that of surrounding silicon, but the expansion of copper A higher coefficient will produce mechanical tension sufficient to cause the component to break.” The team members also include Teng Wang and Johan Liu.

In addition, compared with copper, nanotubes are more conductive, lighter, and the manufacturing process is simpler than carbon thin films (ie, graphene); in order to confirm its research perspective, the research team at Chalmers University of Technology recently made a In the experiment, two chips were punched, then the holes of the silicon chips were filled with carbon nanotubes, and the chips were piled up with an adhesive. As a result, it was found that the two materials can be well combined in terms of electronic conductivity and thermal expansion.

However, this method of filling TSV process 3D silicon chip holes with carbon nanotubes is one of the obstacles that must be overcome to achieve mass production. It is the temperature of the process: Carbon nanotubes are usually produced at 700 degrees Celsius, but CMOS chips are over. At 450 degrees Celsius, damage will occur; if this problem can be solved -- for example, producing nanotubes on a stand-alone process and mechanically filling it -- researchers expect the technology they develop to be commercialized within five years.

Copper PCB

Copper substrate is the most expensive metal substrate, and its thermal conductivity is many times better than that of aluminum substrate and iron substrate. It is suitable for high-frequency circuits, areas with large changes in high and low temperature, and the heat dissipation and architectural decoration industries of precision communication equipment. The copper substrate circuit layer has great current carrying capacity and thermal aging resistance.

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