There are four special plating methods in the production of circuit boards, which refer to row plating equipment, through-hole plating, reel-selective plating, and brush plating. This article introduces these four special methods in detail.
1, finger-type plating equipment
In electroplating, it is often necessary to plate rare metals on board edge connectors, board edge protruding contacts or gold fingers to provide lower contact resistance and higher wear resistance. This technique is called finger-plated plating or protruding partial plating. .
In electroplating, gold is also plated on the inner side of the plate-side connector protruding with nickel. The gold finger or the edge of the plate is manually or automatically plated. The gold plating on the contact plug or gold finger has been plated. Lead and plated buttons are replaced.
2, through hole plating
There are a number of ways in via plating to create a desirable layer of plating on the walls of the substrate bore, which is known in the industry as hole wall activation. Its commercial production process for printed circuits requires multiple intermediate tanks, each with its own control and maintenance requirements.
Through-hole plating is a necessary manufacturing process for the drilling process. When the drill bit is drilled through the copper foil and the substrate below it, the heat generated causes the insulating synthetic resin constituting most of the substrate substrate to melt, the molten resin and other drilled fragments. It is deposited around the hole and coated on the newly exposed hole wall in the copper foil.
In fact, this is detrimental to the subsequent plating surface. The molten resin also leaves a hot layer on the substrate wall, which exhibits poor adhesion to most activators, which requires the development of another A technique similar to stain removal and etchback chemistry: ink!
The ink is used to form a highly adhesive, highly conductive film on the inner wall of each through hole, so that it is not necessary to use multiple chemical treatment processes, only one application step is required, followed by thermal curing, and all the holes can be used. The inner side forms a continuous film which can be directly electroplated without further processing. This ink is a resin-based material that has a very strong adhesion and can be bonded to most thermally polished walls without any effort, thus eliminating the etch back step.
3, reel linkage type plating
Pins and pins for electronic components, such as connectors, integrated circuits, transistors, and flexible printed circuits, are selectively plated for good contact resistance and corrosion resistance.
This plating method can be carried out by manual plating production line or automatic plating equipment. It is very expensive to select each of the pins separately. Therefore, batch welding must be used. In the electroplating production, the crucible is usually flattened to the required thickness of the metal foil. Both ends are die-cut, chemically or mechanically cleaned, and then selectively plated using nickel, gold, silver, rhodium, button or tin-nickel alloy, copper-nickel alloy, nickel-lead alloy, and the like.
4, brush plating
The last method is called "brush plating": it is an electrodeposition technique in which not all parts are immersed in the electrolyte during the plating process. In this plating technique, only a limited area is plated without any effect on the rest.
1, finger-type plating equipment
In electroplating, it is often necessary to plate rare metals on board edge connectors, board edge protruding contacts or gold fingers to provide lower contact resistance and higher wear resistance. This technique is called finger-plated plating or protruding partial plating. .
In electroplating, gold is also plated on the inner side of the plate-side connector protruding with nickel. The gold finger or the edge of the plate is manually or automatically plated. The gold plating on the contact plug or gold finger has been plated. Lead and plated buttons are replaced.
2, through hole plating
There are a number of ways in via plating to create a desirable layer of plating on the walls of the substrate bore, which is known in the industry as hole wall activation. Its commercial production process for printed circuits requires multiple intermediate tanks, each with its own control and maintenance requirements.
Through-hole plating is a necessary manufacturing process for the drilling process. When the drill bit is drilled through the copper foil and the substrate below it, the heat generated causes the insulating synthetic resin constituting most of the substrate substrate to melt, the molten resin and other drilled fragments. It is deposited around the hole and coated on the newly exposed hole wall in the copper foil.
In fact, this is detrimental to the subsequent plating surface. The molten resin also leaves a hot layer on the substrate wall, which exhibits poor adhesion to most activators, which requires the development of another A technique similar to stain removal and etchback chemistry: ink!
The ink is used to form a highly adhesive, highly conductive film on the inner wall of each through hole, so that it is not necessary to use multiple chemical treatment processes, only one application step is required, followed by thermal curing, and all the holes can be used. The inner side forms a continuous film which can be directly electroplated without further processing. This ink is a resin-based material that has a very strong adhesion and can be bonded to most thermally polished walls without any effort, thus eliminating the etch back step.
3, reel linkage type plating
Pins and pins for electronic components, such as connectors, integrated circuits, transistors, and flexible printed circuits, are selectively plated for good contact resistance and corrosion resistance.
This plating method can be carried out by manual plating production line or automatic plating equipment. It is very expensive to select each of the pins separately. Therefore, batch welding must be used. In the electroplating production, the crucible is usually flattened to the required thickness of the metal foil. Both ends are die-cut, chemically or mechanically cleaned, and then selectively plated using nickel, gold, silver, rhodium, button or tin-nickel alloy, copper-nickel alloy, nickel-lead alloy, and the like.
4, brush plating
The last method is called "brush plating": it is an electrodeposition technique in which not all parts are immersed in the electrolyte during the plating process. In this plating technique, only a limited area is plated without any effect on the rest.
Flat Wire High Current Inductor
Flat Wire High Current Inductor,Small Flat Wire Common Mode Inductors,High Current Flat Wire Inductors,High Power Flat Wire Inductors
Shenzhen Sichuangge Magneto-electric Co. , Ltd , https://www.scginductor.com