Dr. Chen Haiying, Director of Electronic Application Development of Jingke, said in an interview with Gaogong LED that all of their products use flip-chip welding technology based on APT patent technology to realize gold-free and solid-free crystal of single-chip and multi-chip modules. Glue encapsulation. From her explanation, this process must first be flip-chip bonding technology, followed by no gold wire or solid crystal glue. According to the reporter, in addition to the absence of the above accessories, there is no bracket.
Save three major accessories, is the cost lower?
The current cost of the gold wire and the bracket in the entire package is 5-6% and 15%-20%, respectively, and the overall calculation does not exceed 30%.
“Now only the high-end market uses gold wire. In general, the packaging factory will use the alloy wire in order to save costs.†A vice president of a gold wire factory in Shandong told reporters. Of course, there are also companies that use iron wire. If the cost of using alloy wire is reduced by at least half, the wire will be lower.
The lost solid glue is not equal to the use of glue. Jingke Electronics mainly uses silver glue. The price of silver glue is obviously much more expensive than our ordinary silica gel. It is understood that silver glue is mainly imported, the price is more than 10 times that of ordinary silica gel.
The highest cost of "no packaged chips" is the high equipment investment brought by process improvement. It is understood that this process is one of the current 70 process forms of semiconductor packaging, and has survived for more than 10 years. But after grafting it to the LED, it did not maintain the low cost advantage of the semiconductor, but pushed up the cost.
"The unpackaged chip is actually a big project, and its change is not just from the package." He Yunbo, general manager of the Han family, said that the change is from the chip back-end process, and it does not require a die bonder. Wire bonding machine.
Luo Chao, director of the R&D center of Cui Tao Automation, also said that the unpackaged chip is the first to use the chip, which uses flip chip. The biggest problem is the machine. Once it is popularized, most of the equipment in the packaging factory cannot be used. The process of the packaging factory is also a problem. At the beginning, the yield is difficult to reach the expected value.
Zheng Tiemin, general manager of Inspur Huaguang does not recognize it. He believes that the cost is to be considered comprehensively. The cost of buying imported equipment and domestic equipment is different. The cost of using formal and flip chip is different. However, because it is a special equipment, if the manufacturer directly on the package-free chip, there is no problem of depreciation.
It is understood that the current traditional semiconductor equipment manufacturers have special equipment for Flip-Chip, and a few equipment factories including Cui Tao in China have been involved. A deputy general manager of a equipment manufacturer broke the news to reporters. The equipment is up to several million each, and the current price of a package line is about 1 million.
Zhang Mingsheng, vice president of Jingke Electronics, said in an interview that because the flip-chip welding technology has a complicated process compared to the formal dressing, the individual cost of the product is offset by the cost savings of the material. The core value of its products is currently not at cost, but in terms of the application characteristics and functions of special technologies.
Up to now, Taiwan's factories include New Century, Ronda, TSMC, and Yuanyuan. The international giants Philips and Cree have unpackaged chip products. According to the reporter, there are a few chip factories and packaging factories in mainland China that are considering or developing, and even a general manager of an aluminum substrate manufacturer said that they are also developing, and hope to launch the market soon.
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