The LED chip in the LED lamp is an electronic component with a large heat flux density. During the operation, due to its static and dynamic losses, a large amount of excess heat is generated, and the heat dissipation system dissipates to the outside to maintain its operating temperature stable. At present, the luminous efficiency of the LED is still relatively low, resulting in increased junction temperature and reduced lifetime. In order to reduce the junction temperature in order to improve the life, it must pay attention to the issue of heat dissipation. The heat-dissipation design of the LED must start from the chip all the way to the entire radiator, and every link must give full attention. Improper design of any one part can cause serious heat dissipation problems. So we must pay full attention to the design of heat dissipation.
The high-performance microgroove group composite phase change heat transfer technology meets the heat dissipation requirements of high-power LED lighting, and the technology is named “micro-groove group composite phase change integrated cooling technologyâ€. The technology has been successfully applied to LED lamps. The heat of the LED chips can be instantaneously distributed in the entire cooling space, prolonging the life of the LED lamp and improving the luminous efficiency.
First, micro trough complex phase change integrated cooling technology:
The heat generated by the LED chip is always dispersed into the air through the housing of the lamp. The general heat dissipation is that the heat generated by the LED chip comes out of its metal heat dissipation block, and then passes through the solder to the PCB of the aluminum substrate, and then passes through the heat conductive paste to reach the aluminum heat sink. The heat dissipation of LED lamps actually includes heat conduction and heat dissipation. There is a concept first to be clear, that is, the difference between heat conduction and heat dissipation. Heat conduction is to transfer heat from the heat source to the surface of the heat sink as fast as possible, and heat dissipation is to dissipate heat from the heat sink surface into the air. The first thing to do is to export the heat the fastest and then distribute it to the air most effectively. The heat sink of traditional radiators is aluminum fins. Our heat sinks are: microgroove group phase transition technology.
The micro-groove group phase change cooling technology relies on technical means (such as equipment structure: micro-grooves, etc.) to turn the closed circulating cooling medium (if the medium is water) into nanometer-scale water film. The thinner the water film, the greater the capacity for thermal evaporation. The stronger the latent heat exchange capability is, the stronger the heat of high-power electronic devices is taken away by the vapor.
Cooler system composition and working principle:
1. The composition of the cooler:
The system is mainly composed of four parts, namely the heat extractor, the condenser, the transmission pipeline, and the heating medium (such as water, ethanol, etc.).
The heat extractor is generally made of imported aluminum alloy. There are many micron-sized channels in the inner cavity of the plate. Its function is to change the heating medium (such as water) to the required liquid film according to the design requirements, and the heating power device and the aluminum alloy. The surface is in close contact with the heat energy transferred to the liquid film through the aluminum heat, the liquid film instantaneously vaporizes, and the heat energy is sent to the condenser through the pipeline for cooling. Since the heat-receiving capacity of the heat extractor is very strong and its thermal conductivity is greater than 106 W/(m*°C), the volume of the heat extractor can be made small.
The condenser is generally made of imported aluminum alloy. There are many millimeter-level channels in the inner cavity of the plate. There are fins outside the aluminum alloy plate. The heat medium is sent through the pipe to send heat energy and it is responsible for the convection heat exchange with the outdoor air. Radiation heat exchange, take the heat energy of the heat medium to release through the condenser, change from the liquid state to the liquid state, the liquid heat medium returns to the heat collector through its own gravity, ready for the next heat exchange cycle.
2, working principle:
A number of microchannels are processed on the inner surface of the capillary phase group composite phase change heat collector to form a micro trough group structure, and the heat transfer mechanism is enhanced by the fine-scale composite phase transition to achieve a high heat flux density for small volumes in a narrow space. High-power devices take heat efficiently. The heat extracted by the capillary trough composite phase change heat collector is transported from the steam to the remote high-efficiency micro-structure condenser by the steam circuit, and the high-strength micro-scale steam is performed on the surface of the fine-scale condensation trough group structure in the micro-structure condenser. Condensation heat. The heat released by the condenser condensation can be quickly diffused to the surface of the fine-scale condensation trough group structure, and is transmitted through the wall surface outward to the rib surface of the outer wall of the micro-structure condenser, and the heat is released by convective heat exchange with the external environment. Go to the environment. The condensate passes through the condensing liquid circuit and flows back to the microgroove group composite phase change heat exchanger under pressure gradient action. In order to achieve the system's own heat and heat of the high efficiency, no power consumption of the closed cycle, to achieve the purpose of device cooling. The heating surface of the micro-groove group composite phase change heat collector is in close contact with the power electronic device. Many composite phase change microchannels are engraved on the inner surface of the microgroove group, and are integrated into a composite phase change microgroove group. There are a small number of liquid working fluids with certain latent heat of vaporization in the microgroove group composite phase change heat collector. The liquid medium flows along the microgroove under the capillary pressure gradient formed by the micro trough's own structure, and at the same time forms a high-strength fine-scale composite of thin meniscus evaporation and thick liquid film nucleate boiling in the micro trough. The phase transition enhances the heat transfer process, which turns the liquid medium into steam, and uses vaporized latent heat to remove the huge heat generated during the power electronic device operation, thereby reducing the operating temperature of the device and controlling it within an ideal range. The micro-groove group composite phase change cooling system is composed of a small-sized heating element (micro-groove group composite phase change heat collector), a heat and fluid transportation pipeline, and a remote heat release element (remote micro-structure condenser). Among them, the heat and fluid transport pipeline includes two parts: a steam circuit for transporting heat and a condensate circuit for transporting the condensate, respectively connecting the micro-groove group composite phase change heat collector and the remote microstructured condenser to form a Externally closed micro negative pressure circulation system. The large amount of heat extracted by the microgroove group composite phase change heat extractor is transported by the steam under the system's evaporative and condensation pressure differentials to the remote micro-structure coagulator through the steam loop, and the fine-scale condensation in the micro-structure coagulator internal cavity The high-intensity micro-scale vapor condensation heat release occurs on the surface of the trough structure. The heat released by the steam condensation is transmitted from the surface of the fine-scale coagulation trough group structure through the wall outward to the cooling water channel group on the surface of the ribs on the outer wall of the micro-structure condenser or on the outer wall. (Note: The micro-structured condenser wall faces the external environment and The cooling water is isolated from the inside of the microstructure condenser, the external environment and the cooling water do not contact with the condensate in the microstructure condenser, and the air (natural or forced) convection heat exchange with the external environment or the cooling water channel group The cooling water in the single-phase forced convection heat exchange eventually lost to the external environment. The condensate flows through the condensate circuit and flows back to the microgroove group composite phase change heat collector by means of the pressure gradient generated by gravity and the system's fine-scale trough structure. Thus, the entire system forms a unidirectional flow of the working fluid in the order of the micro-groove group composite phase change heat extractor, the steam circuit, the remote microstructured condenser, the condensate circuit, and then returns to the micro trough group composite phase change heat collector. The liquid-vapour-liquid phase change takes heat and exothermic mode of the power-free cycle (passive cycle) to achieve the purpose of cooling high-power heating power electronic devices.
3, the difference with the heat pipe is similar to the heat pipe in the form, but there are essential differences in the heat transfer mechanism, structure and performance, etc.:
1. A powerful micro-scale composite phase transition heat transfer mechanism is adopted; the heat pipe is only an ordinary liquid film evaporation;
2. No heat pipe inherent boiling, helium, capillary force and many other heat transfer limit;
3. The high contact thermal resistance and thermal resistance of the heat-dissipating heat pipe and the cumbersome and complicated device;
4. No heat pipe startup and job stability issues;
5. The heat capacity per unit area at the same temperature is about 100 times higher than that of a heat pipe, and the system is simple, lightweight, and compact.
Second, micro trough group composite phase change LED high power light source cooler features:
1, super thermal conductivity:
The micro-groove group composite phase-change cooling technology has super thermal conductivity and its thermal conductivity is 10,000 times that of the aluminum substrate. This technology can timely send the heat of the LED chip to each heat-dissipating surface of an infinite-sized aluminum substrate.
Thermal conductivity greater than 106 W/(m*°C). Copper is an excellent conductor and an excellent thermal conductor. Copper has a thermal conductivity of about 400 W/(m*°C). MGCP has a thermal conductivity and a copper ratio and has superconductivity. A 200-cm long copper rod with a diameter of 1.3 cm is used to deliver 200 W of thermal energy at a working temperature of 100°C. The temperature difference between the two ends of the copper rod is as high as 70°C; the MGCP heat sink is made of half the weight of the copper rod. In the 100 °C working temperature delivery of 200W of thermal energy, heat transfer distance is also 60cm far, the temperature drop of only 0.5 °C, experiments show that MGCP technology has super-thermal conductivity.
2, super cooling capacity:
The heat and heat flux has reached 400W/, which is 1000 times higher than water cooling and 100 times higher than heat pipe. The heating capacity is 100 times higher than forced water cooling and 1000 times higher than forced air cooling.
At 1 standard atmospheric pressure, the boiling point of water is 100°C, 1Kg of water is heated from 99°C to 100°C, the required thermal energy is 4200 Joules; 1Kg of 100°C water absorbs heat and 100°C of vapor, the temperature does not change, but The amount of heat absorbed was 2,260,000 joules. The water cooling is sensible heat exchange, and the heat exchange heat is low. The MGCP technology is latent heat exchange and the heat exchange capacity is super strong. 1Kg of water heated at 1°C requires only 4,200 Joules of heat, and 1Kg of water at 100°C absorbs heat and changes temperature to 100°C. The temperature does not change, but the amount of heat absorbed is 2,260,000 joules. The amount of heat absorbed by the two is more than 500 times. Therefore, There is a huge difference in heat transfer capacity between the two.
3, no power cooling:
Passive cooling, no fan or water pump, no energy consumption for cooling, no power running, energy saving. MGCP technology is the clever use of high-power power electronics to generate heat energy to evaporate the heating medium to generate kinetic energy and potential energy. The vapor flows to the condenser and exothermically condenses into liquid. The capillary force of the microcatch of the heat exchanger and liquid gravity return to the system. High-power power electronic devices are closely attached to the heat extractor so as to realize a closed heat-dissipating cycle without external power.
4, light weight, small size:
It weighs less than 25% of the existing radiator, and its volume can be as small as 20% or less.
5, high reliability:
The device is compact, stable, and has no start-up problems. Its reliability is much higher than that of fans, water-cooled and heat pipe radiators.
6, low cost, environmental protection:
The cost of the product is less than that of fans, water-cooled and heat-pipe radiators; the phase-change working medium is environmentally friendly, with less consumption.
7, waste heat utilization:
The heat (waste heat) generated by high-power power electronic devices can be changed into hot water of 50° C. to 60° C. for daily use, replacing electric water heaters to achieve energy saving.
LED lighting technology is still advancing at a rapid pace. With the advancement of technology, the micro-groove group composite phase change technology has matured. Many LED lighting companies in China are gradually putting into use. It is believed that in the near future, this technology will Going into more high-power LED lighting manufacturers who are bothered by heat dissipation issues, really solve the problem of heat dissipation.
The high-performance microgroove group composite phase change heat transfer technology meets the heat dissipation requirements of high-power LED lighting, and the technology is named “micro-groove group composite phase change integrated cooling technologyâ€. The technology has been successfully applied to LED lamps. The heat of the LED chips can be instantaneously distributed in the entire cooling space, prolonging the life of the LED lamp and improving the luminous efficiency.
First, micro trough complex phase change integrated cooling technology:
The heat generated by the LED chip is always dispersed into the air through the housing of the lamp. The general heat dissipation is that the heat generated by the LED chip comes out of its metal heat dissipation block, and then passes through the solder to the PCB of the aluminum substrate, and then passes through the heat conductive paste to reach the aluminum heat sink. The heat dissipation of LED lamps actually includes heat conduction and heat dissipation. There is a concept first to be clear, that is, the difference between heat conduction and heat dissipation. Heat conduction is to transfer heat from the heat source to the surface of the heat sink as fast as possible, and heat dissipation is to dissipate heat from the heat sink surface into the air. The first thing to do is to export the heat the fastest and then distribute it to the air most effectively. The heat sink of traditional radiators is aluminum fins. Our heat sinks are: microgroove group phase transition technology.
The micro-groove group phase change cooling technology relies on technical means (such as equipment structure: micro-grooves, etc.) to turn the closed circulating cooling medium (if the medium is water) into nanometer-scale water film. The thinner the water film, the greater the capacity for thermal evaporation. The stronger the latent heat exchange capability is, the stronger the heat of high-power electronic devices is taken away by the vapor.
Cooler system composition and working principle:
1. The composition of the cooler:
The system is mainly composed of four parts, namely the heat extractor, the condenser, the transmission pipeline, and the heating medium (such as water, ethanol, etc.).
The heat extractor is generally made of imported aluminum alloy. There are many micron-sized channels in the inner cavity of the plate. Its function is to change the heating medium (such as water) to the required liquid film according to the design requirements, and the heating power device and the aluminum alloy. The surface is in close contact with the heat energy transferred to the liquid film through the aluminum heat, the liquid film instantaneously vaporizes, and the heat energy is sent to the condenser through the pipeline for cooling. Since the heat-receiving capacity of the heat extractor is very strong and its thermal conductivity is greater than 106 W/(m*°C), the volume of the heat extractor can be made small.
The condenser is generally made of imported aluminum alloy. There are many millimeter-level channels in the inner cavity of the plate. There are fins outside the aluminum alloy plate. The heat medium is sent through the pipe to send heat energy and it is responsible for the convection heat exchange with the outdoor air. Radiation heat exchange, take the heat energy of the heat medium to release through the condenser, change from the liquid state to the liquid state, the liquid heat medium returns to the heat collector through its own gravity, ready for the next heat exchange cycle.
2, working principle:
A number of microchannels are processed on the inner surface of the capillary phase group composite phase change heat collector to form a micro trough group structure, and the heat transfer mechanism is enhanced by the fine-scale composite phase transition to achieve a high heat flux density for small volumes in a narrow space. High-power devices take heat efficiently. The heat extracted by the capillary trough composite phase change heat collector is transported from the steam to the remote high-efficiency micro-structure condenser by the steam circuit, and the high-strength micro-scale steam is performed on the surface of the fine-scale condensation trough group structure in the micro-structure condenser. Condensation heat. The heat released by the condenser condensation can be quickly diffused to the surface of the fine-scale condensation trough group structure, and is transmitted through the wall surface outward to the rib surface of the outer wall of the micro-structure condenser, and the heat is released by convective heat exchange with the external environment. Go to the environment. The condensate passes through the condensing liquid circuit and flows back to the microgroove group composite phase change heat exchanger under pressure gradient action. In order to achieve the system's own heat and heat of the high efficiency, no power consumption of the closed cycle, to achieve the purpose of device cooling. The heating surface of the micro-groove group composite phase change heat collector is in close contact with the power electronic device. Many composite phase change microchannels are engraved on the inner surface of the microgroove group, and are integrated into a composite phase change microgroove group. There are a small number of liquid working fluids with certain latent heat of vaporization in the microgroove group composite phase change heat collector. The liquid medium flows along the microgroove under the capillary pressure gradient formed by the micro trough's own structure, and at the same time forms a high-strength fine-scale composite of thin meniscus evaporation and thick liquid film nucleate boiling in the micro trough. The phase transition enhances the heat transfer process, which turns the liquid medium into steam, and uses vaporized latent heat to remove the huge heat generated during the power electronic device operation, thereby reducing the operating temperature of the device and controlling it within an ideal range. The micro-groove group composite phase change cooling system is composed of a small-sized heating element (micro-groove group composite phase change heat collector), a heat and fluid transportation pipeline, and a remote heat release element (remote micro-structure condenser). Among them, the heat and fluid transport pipeline includes two parts: a steam circuit for transporting heat and a condensate circuit for transporting the condensate, respectively connecting the micro-groove group composite phase change heat collector and the remote microstructured condenser to form a Externally closed micro negative pressure circulation system. The large amount of heat extracted by the microgroove group composite phase change heat extractor is transported by the steam under the system's evaporative and condensation pressure differentials to the remote micro-structure coagulator through the steam loop, and the fine-scale condensation in the micro-structure coagulator internal cavity The high-intensity micro-scale vapor condensation heat release occurs on the surface of the trough structure. The heat released by the steam condensation is transmitted from the surface of the fine-scale coagulation trough group structure through the wall outward to the cooling water channel group on the surface of the ribs on the outer wall of the micro-structure condenser or on the outer wall. (Note: The micro-structured condenser wall faces the external environment and The cooling water is isolated from the inside of the microstructure condenser, the external environment and the cooling water do not contact with the condensate in the microstructure condenser, and the air (natural or forced) convection heat exchange with the external environment or the cooling water channel group The cooling water in the single-phase forced convection heat exchange eventually lost to the external environment. The condensate flows through the condensate circuit and flows back to the microgroove group composite phase change heat collector by means of the pressure gradient generated by gravity and the system's fine-scale trough structure. Thus, the entire system forms a unidirectional flow of the working fluid in the order of the micro-groove group composite phase change heat extractor, the steam circuit, the remote microstructured condenser, the condensate circuit, and then returns to the micro trough group composite phase change heat collector. The liquid-vapour-liquid phase change takes heat and exothermic mode of the power-free cycle (passive cycle) to achieve the purpose of cooling high-power heating power electronic devices.
3, the difference with the heat pipe is similar to the heat pipe in the form, but there are essential differences in the heat transfer mechanism, structure and performance, etc.:
1. A powerful micro-scale composite phase transition heat transfer mechanism is adopted; the heat pipe is only an ordinary liquid film evaporation;
2. No heat pipe inherent boiling, helium, capillary force and many other heat transfer limit;
3. The high contact thermal resistance and thermal resistance of the heat-dissipating heat pipe and the cumbersome and complicated device;
4. No heat pipe startup and job stability issues;
5. The heat capacity per unit area at the same temperature is about 100 times higher than that of a heat pipe, and the system is simple, lightweight, and compact.
Second, micro trough group composite phase change LED high power light source cooler features:
1, super thermal conductivity:
The micro-groove group composite phase-change cooling technology has super thermal conductivity and its thermal conductivity is 10,000 times that of the aluminum substrate. This technology can timely send the heat of the LED chip to each heat-dissipating surface of an infinite-sized aluminum substrate.
Thermal conductivity greater than 106 W/(m*°C). Copper is an excellent conductor and an excellent thermal conductor. Copper has a thermal conductivity of about 400 W/(m*°C). MGCP has a thermal conductivity and a copper ratio and has superconductivity. A 200-cm long copper rod with a diameter of 1.3 cm is used to deliver 200 W of thermal energy at a working temperature of 100°C. The temperature difference between the two ends of the copper rod is as high as 70°C; the MGCP heat sink is made of half the weight of the copper rod. In the 100 °C working temperature delivery of 200W of thermal energy, heat transfer distance is also 60cm far, the temperature drop of only 0.5 °C, experiments show that MGCP technology has super-thermal conductivity.
2, super cooling capacity:
The heat and heat flux has reached 400W/, which is 1000 times higher than water cooling and 100 times higher than heat pipe. The heating capacity is 100 times higher than forced water cooling and 1000 times higher than forced air cooling.
At 1 standard atmospheric pressure, the boiling point of water is 100°C, 1Kg of water is heated from 99°C to 100°C, the required thermal energy is 4200 Joules; 1Kg of 100°C water absorbs heat and 100°C of vapor, the temperature does not change, but The amount of heat absorbed was 2,260,000 joules. The water cooling is sensible heat exchange, and the heat exchange heat is low. The MGCP technology is latent heat exchange and the heat exchange capacity is super strong. 1Kg of water heated at 1°C requires only 4,200 Joules of heat, and 1Kg of water at 100°C absorbs heat and changes temperature to 100°C. The temperature does not change, but the amount of heat absorbed is 2,260,000 joules. The amount of heat absorbed by the two is more than 500 times. Therefore, There is a huge difference in heat transfer capacity between the two.
3, no power cooling:
Passive cooling, no fan or water pump, no energy consumption for cooling, no power running, energy saving. MGCP technology is the clever use of high-power power electronics to generate heat energy to evaporate the heating medium to generate kinetic energy and potential energy. The vapor flows to the condenser and exothermically condenses into liquid. The capillary force of the microcatch of the heat exchanger and liquid gravity return to the system. High-power power electronic devices are closely attached to the heat extractor so as to realize a closed heat-dissipating cycle without external power.
4, light weight, small size:
It weighs less than 25% of the existing radiator, and its volume can be as small as 20% or less.
5, high reliability:
The device is compact, stable, and has no start-up problems. Its reliability is much higher than that of fans, water-cooled and heat pipe radiators.
6, low cost, environmental protection:
The cost of the product is less than that of fans, water-cooled and heat-pipe radiators; the phase-change working medium is environmentally friendly, with less consumption.
7, waste heat utilization:
The heat (waste heat) generated by high-power power electronic devices can be changed into hot water of 50° C. to 60° C. for daily use, replacing electric water heaters to achieve energy saving.
LED lighting technology is still advancing at a rapid pace. With the advancement of technology, the micro-groove group composite phase change technology has matured. Many LED lighting companies in China are gradually putting into use. It is believed that in the near future, this technology will Going into more high-power LED lighting manufacturers who are bothered by heat dissipation issues, really solve the problem of heat dissipation.
Kara offers a range of Rotary Switches.Ranging from 5 to 9 poles,15VA to 25 amp,with many choices of functions,especially the switches with High-Current .Certifications include CSA, CE, and more.
This item used very in the line of cooler,with metal panel or plastic panel or only switch are all available.
Rotary Switch,Rotary Switch Knobs,Rotary Switch 6 Position,Mini Rotary Switch
Ningbo Kara Electronic Co.,Ltd. , https://www.kara-switch.com