Recently, LED packaging factory Leisheng Optoelectronics announced high-power LED packaging module, with COB packaging technology, with good heat dissipation, low cost, uniform color temperature, etc., its integrated package to the product application side and other one-stop services, to provide the best in the industry Lighting solutions.
Leisheng Optoelectronics has multi-national patents in the COB packaging process. Its new structure adopts the design of long-side light emission. The light strip itself can be disassembled and replaced by light source, which makes the LED lamp have better heat dissipation and can effectively avoid the bright and dark light. The problem of both. At the same time, Leisheng photoelectric LED lighting module; will design a series of light source modules based on indoor lighting, saving nearly 1/3 of the cost of traditional six-light strips, and it is estimated that the cost of the light source module will be reduced by nearly 20%.
Industry analysis, LED applications are growing rapidly, and the cost optimization of LED lighting modules is expected. The LED backlight module is estimated to have a cost reduction of more than 20% in 2010.
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