Tencent Digital (Zhou Shuo) On November 18, Guizhou Huaxintong Semiconductor officially opened its Beijing R&D center. Beijing Huaxin Semiconductor Technology Co., Ltd., a wholly-owned subsidiary of Huaxin Semiconductor, has also settled here. Leaders of Gui'an New Area in Guizhou Province, Global Presidents of Qualcomm Incorporated (Huaxin Tongda Shareholder) and senior executives of Huaxin Semiconductor's semiconductor companies and relevant responsible personnel attended the opening ceremony and unveiled the Beijing R&D Center.
The launch of Huaxin Semiconductor's Beijing R&D center is not only an important milestone in the development of Huaxin Semiconductor. It is also considered as a strategic move by Qualcomm to take root in the Chinese market and attack server processors. Of course, this objectively promotes domestic semiconductors. The advancement of the industry. Through the tripartite cooperation of the Guizhou government, Huaxin Semiconductor, and Qualcomm, the 10nm-based server processor will be just around the corner.
Guizhou Huaxintong Semiconductor Technology Co., Ltd. was jointly established by the Guizhou Provincial People's Government and Qualcomm, and introduced key technologies such as CPU microstructure, multi-core interconnection and SOC for high-end server chip instruction sets through introduction, digestion, absorption, and innovation. We will develop advanced server chip products suitable for the Chinese market and strive to achieve better service for China's big data industry through technological and commercial success.
Since the establishment of Huaxin Semiconductor in January 2016, it has progressed smoothly and has been steadily progressing according to the schedule: In early May, Qualcomm successfully completed the handover of the first batch of server development platforms. It was unveiled at the 2016 China Big Data Expo on May 25. 7 Received ARM v8-A architecture authorization. It is believed that through the cooperation of the Guizhou government, Huaxin Semiconductor, and Qualcomm, the 10-nm processor based on the characteristics of China's big data server market is just around the corner.
Antenk DIN41612 Connectors are a versatile two piece PCB connector set with feaures useful for many applications including connections for plug-in card and back-panel wiring, PCB to PCB attachment and peripheral connections for external interfaces. Features include a multitude of body sizes and styles with options that include selective contact loading, make and break contacts, contact lead length choices and contact plating variations each in .100" [2.54mm] or .200" [5.08mm] centerline spacing.
The DIN 41612 standard covers a series of two-piece backplane connectors widely used in rack-based telecommunication, computing, process control, medical, industrial automation, test and measurement and military/aerospace systems where long-term reliability is required. They consist of one to three rows of contacts in combinations of 16, 32, 48, 64, or 96 contacts on a 0.1-inch (2.54 mm) grid pitch. The 3 rows are labelled a, b and c and connectors up to 64 way if using a 96 way body can use either rows a+b or a+c. DIN 41612 Signal connectors can be rated to 1.5 amps per signal pin, at 500 volts, although these figures may be de-rated according to safety requirements or environmental conditions. Several hybrid power and coaxial configurations are available that can handle up to 5.6A or even 15A. This wealth of variations explains the very wide range of applications that they`re put to. For over 30 years these DIN 41612 `Euro Card` connectors to IEC 60603-2 have offered a highly reliable system for board interconnects. Precision contact density, low mating forces, a two piece protective design and many contact termination styles offer unlimited design opportunities. Termination methods include – straight PC, solder eyelet, wire wrap, crimp and [press fit" terminals. Insertion and removal force are controlled, and three durability grades are available. Standardisation of the connectors is a prerequisite for open systems, where users expect components from different suppliers to operate together; ept and Conec DIN 41612 are therefore fully intermateable with all other similarly compliant products from other manufacturers like Harting, Erni, Hirose and TE Connectivity, etc.
The most common connector in the DIN product line is type C, which is widely used in VMEbus systems, the DIN 41612 standard has been upgraded to meet international standards IEC 60603-2 and EN 60603-2. In the past, ept used a comb supported press-fit tool for their type C and B press-fit female connectors. To be more competitive, ept has changed to flat-rock technology (just a flat piece of steel pushed on the top of the connector) as used by many other manufacturers.
DIN 41612 Connectors are widely used in rack-based electrical systems. The standard performance of these connectors is a 2 A per pin current carrying capacity and 500 V working voltage. Both figures may be variable due to safety and environmental conditions.
Types
Number of contacts varies
Many variations of housing material, including different types of metal and plastic
Both angled and straight versions
Male and female
C,R,B,Q Type DIN41612 Connectors
Half C, R, B & Q Type DIN41612 Connectors
1/3 C,R, B & Q Type DIN41612 Connectors
H, F, H+F & M type DIN41612 Connectors
IDC Type DIN41612 Connectors
Female Cable Connector
High Pin Count DIN41612 Connectors
Shroud DIN41612 Connectors
Features and Benefits of Din41612 Connector:
• Indirect mating (male/female)
• Automated production processes
• Continuous quality assurance
• 3-160 contacts
• Complete interconnection system
• Numerous interface connectors
• A wide variety of hoods
• Many termination technologies provide for the lowest installed cost
• Contacts selectively gold-plated
• Tinned terminations for increased solderability
Uses
The primary use of DIN 41612 connectors are PCB Connectors and motherboards, the main acceptance would be their board to board reliable connections.
Applications of Din41612 Connector:
Applications
• Data centers
• Storage
• Servers
• Base stations
• Telecommunications equipment
• Backplane and motherboard assemblies
• Switching systems
• Modular rack systems
• Power automation
• Distributed control systems in
industrial control
• Programmable logic controllers (PLC)
• Robotics
• Test and lab equipment
• Energy distribution
• Monitoring equipment
This is not a definitive list of applications for this product. It represents some of the more common uses.
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