The first two days of explosion news, AMD and Intel, all met everyone. Xiao Bian also reported in Fan News Fan. Continuing this news, there are already physical objects in front of us. This will also give us the opportunity to see what it is after the merger. What exactly is AMD+Intel?
The product of this exposure is Intel's new generation of NUC product, Haddis Canyon, which is simply a highly integrated mini-PC product. The difference is that the previous generation NUC canyon product is a product using i7-6770HQ, so powerful processing. The device still can only use the nuclear display. The reason is nothing more than a volume limit. High performance seems to have been in conflict with Ultra Mini. This combination of Intel and AMD is likely to break this tradition!
To introduce to you: glue fit
The inner view of the combined product is shown below. This is a glue fit, not packaged on a single chip. Instead, a different chip is mounted on one substrate. The CPU and GPU are connected using PCI-E. GPU and HBM2 memory are connected using EMIB technology. As for why, Xiaobian slowly told everyone.
1. Technical cooperation has not yet reached the chip level, but it has opened up, and there will certainly be more and more customized products in the future. Moreover, Intel made up for its own short board - graphics performance, AMD continues to win more "silver" through the customization strategy, you sell CPU I sell GPU. Don't forget, AMD's customization on the PS4/Pro and Xbox ONE/X/360 has earned it a lot of money, and everyone has money to earn!
2. Using the PCI-E channel to connect the CPU and the GPU shows that the two are still independent products. It is far from everyone's imagined “zero-distance fitâ€. This is probably not easy to realize. It is not just the strategies and interests of the two companies. Problems are even more technical.
3. Super glue adhesive EMIB, Intel proposed EMIB is to allow the assembly of different process components to achieve a higher cost performance (lower manufacturing costs) purposes. For example, if the GPU is 14nm, and the video memory does not require such advanced process technology, 28nm is enough, then the different components of this mixed process can be connected via EMIB technology with very low latency (meaning far more than PCI -E connection speed and response time are more flexible.
In general, it can be understood as a super glue technology that allows different processes to be mixed together to make finished products.
For performance we can not save power!
The first thing to say is that at present, this combination is at best applicable to NUC products. It is still difficult to implement on Laptops. Although both CPUs and GPUs are on one substrate, the power consumption requirements are cumulative. The most obvious example is to look at the peripheral power circuit. This power supply design is likely to be designed to support more than 100W power consumption. Of course, the Nuc of Hades Canyon (including the previous generation of gorges) was originally a mini high-performance PC, and the processor was the i7 HQ series (TDP thermal power design is 45W), plus the significant power consumption alone. - If you need a lower power consumption product, the Intel processor and AMD APU series can be satisfied.
What GPU performance?
The current news is that the customization adopted by the cooperation is a GFX8 that belongs to the Polaris architecture. Among them, 24 NCU units are quite good. The conversion should be 1536 SP units, and the performance is between RX 560 and RX 570, but the frequency will be Lower, only about 1000MHz, visual inspection to replace GTX1050/Ti is not a problem.
Together with the eight-generation Mobile Core (HQ series), the new Haddis Canyon can be said to be an earth-shaking change from the old model. High-performance CPUs are no longer lame. With the new leveraging capabilities, the mini-PC can also have high performance. Performance, this is a good thing.
After it together?
It can be foreseen that more and more customized products will be produced. This kind of technology cooperation guided by strategy is nothing more than to provide users with better customized products, and this can save a lot of cost and effort in the production process, and the higher the degree of chip integration is. (Even if there are multiple glue chips on one substrate), the lower the threshold for finished product manufacturing.
The user's current needs are different. Customized products are more popular. Through strategic guidance, more and more of these cooperative products will be implemented. Can you tell us when the N-cards have made a big news?
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