The development of automotive electronics is on the rise. European, American and Asian car manufacturers have set off a wave of smart car and electric vehicle (EV) design, which has attracted semiconductor manufacturers to expand their vehicle component lineup. Among them, the new business opportunities triggered by the business operations of China Beidou and Galileo are even more Stimulating the rapid increase in demand for multi-satellite global navigation satellite systems (GNSS) has prompted chip vendors to expand their product lineups.
Edoardo Merli, Director of Market and Applications, Automotive Products Group (APG), Greater China and South Asia, said that GNSS positioning chips are catching up with connected car design trends and shipping in the global automotive market. It is rapidly increasing and has become an important revenue growth momentum for automotive electronics semiconductor factories. With the Beidou satellite in China being commercialized at the end of 2013, and the EU Galileo satellite is also planning to expand the business transfer from 2014 to 2015, the car factory has begun to seek solutions to support the new satellite system, and it is expected to launch another wave of GNSS wafer procurement opportunities. .
In fact, most of the existing GNSS chips only support North American Global Positioning (GPS) and Russian GLONASS, and the two satellite systems have insufficient signal coverage in Europe and Asia Pacific, which affects the positioning accuracy of local car navigation systems. . As a result, the launch of its own satellites in Europe and China is of great significance to local car manufacturers and even telecom operators, which will help relevant operators improve the navigation experience and expect to introduce more machine-to-machine (M2M) applications and adaptability. Service (LBS), creating new business opportunities.
Optimistic about the development potential of the multi-satellite GNSS market, Broadcom has been the first to announce compatibility with China's Beidou, North American Global Positioning (GPS), Galileo, Russia's GLONASS and Japan's Quasi-Zenith Satellite System (QZSS). GNSS receiver single chip.
Not letting Broadcom specialize in the past, STMicroelectronics also followed up with the launch of the new multi-satellite GNSS chip, the Teseo III, in early 2014 to actively expand the card position. Morley emphasized that in addition to tracking satellite signals from all countries, the chip can be combined with exclusive Reckoning and sensor technology to provide an auxiliary navigation solution when the GNSS reception is poor. Positioning accuracy is pushed up to a higher level.
Fabrice Guerrier, STMicroelectronics APG Car Audio and Vehicle Carrier Communications Marketing Manager, added that Teseo III has been field tested by the European Space Agency and official Chinese authorities, and has begun sampling; its integrated radio frequency (RF), digital Controllers and flash memory, which greatly enhance the integration of peripheral components, will help depots and Tier 1 suppliers reduce system bill of materials (BOM) costs while balancing performance.
In addition, Infineon also began to take action to provide a new generation of products to customers. Although some products have not yet entered the mass production stage, Chen Fushun also admitted that he has obtained "Design Win" from many car manufacturers. He further revealed that in the past, Infineon's automotive MCUs for the design of automotive ECUs (Electronic Control Units) were mostly based on 16-bit MCUs, but this must be used in two ways. An MCU can be completed. Considering the cost and system area, it is relatively reasonable to adopt a single 32-bit architecture MCU in the future.
Although the 32-bit MCU for vehicles is a fairly common semiconductor component in the field of automotive electronics, in fact, Infineon has made considerable breakthroughs in the core architecture of the new generation of MCUs. Chen Fushun said that the new generation of automotive MCU product line name is ARUIX, the full range of products are 32-bit architecture, and the full range supports ASIL D standard, MCU itself can accommodate up to three core architecture, single core operation clock can reach 300MHz, and high-end product lines can also support floating-point operations, 2D, 3D video and surround image. As for the price, Chen Fushun is not willing to disclose the specific details, but he also agrees that the past car MCU is only responsible for system control, and Infineon's move will break the industry's traditional perception and imagination of the car MCU.
In addition, Infineon is the same as other automotive semiconductor suppliers, and adopts system-level solutions to meet customer needs. In addition to the significant increase in MCU price/performance ratio, Infineon also has built-in gates for automotive DC/DC components. The Watch Dog function, in order to effectively monitor the multi-power output, whether there is a failure or error function, and the reason for this is also from the automotive specification ISO 26262. In terms of MOSFET, it is to adopt a new packaging method and improve the on-current, but in the aspect of Rdson, it can be effectively reduced. In addition, the heat dissipation capacity is significantly improved compared with the previous generation.
Chen Fushun further revealed that the global market for automotive electronics is ahead of the European and American markets. At present, the Asian market is also catching up, such as the automotive electronics industry in South Korea or Taiwan, for a new generation of automotive semiconductor components. They all have a high degree of interest. On the one hand, they hope to catch up with the European and American markets, and they also hope to obtain orders from European and American car manufacturers.
In addition to Broadcom, STMicroelectronics and Infineon, including Qualcomm, MediaTek, British Commercial Cambridge Wireless Semiconductor (CSR) and IC design companies in mainland China are also actively initiating multi-satellite GNSS chip design, which is expected to be unveiled this year. The prototype of the new product.
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