It is well known that the LED itself generates temperature during operation, and the current packaging characteristics make it difficult for heat to be effectively dissipated. In order to reduce LED thermal exhaustion and extend life, the industry can only rely on large-area heat sinks. The large-area heat sink of LED has long been a bottleneck that LED lighting cannot avoid, but it also indirectly forms the glare and performance flaws, and constitutes the harm of the eyes. Therefore, to solve the above concerns, the design of the thermal module is absolutely the key. Under the good heat dissipation design, the product can achieve stable luminous efficiency and quality, thereby reducing heat exhaustion and improving the life of the product and peripheral components. There are several different interpretations of the thermal module, but how to effectively and truly derive the high heat of the die, and provide industry standards and specifications, and then lead to design, manufacturing, safety management, etc., the LED industry is currently eager Looking for. 
Due to the excellent uniform temperature and conduction characteristics of the uniform temperature (heat) plate, the "point" of high heat flux density can be instantaneously extended to a large heat dissipation field, and heat is radiated by the heat dissipation fins. The principle is nothing more than the capillary structure of the inner wall, the vacuum chamber and the liquid phase of the liquid substance.
In view of the fact that the average temperature (hot) plate on the market is referred to as the "Cold Plate, not Vapor Chamber", such as: Copper plate, Aluminum plate, Ceramic plate, Graphite, etc., rather than the high-efficiency thermally conductive vacuum element Vapor Chamber (true heat transfer element with uniform XYZ conductivity). In short, the heat dissipation capabilities of various products vary considerably. The launch of this product will truly provide a solution and significantly reduce the loss of limited resources on the planet.
At present, the heat dissipation and module industry claims to have patents for uniform temperature (heat) boards, but most of them belong to manufacturing and manufacturing patents. Not only have they failed to pass the testing of authoritative certification units at this stage, but they cannot achieve the goal of rapid quantification.
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